JESD51-14:2011 Test Method 14: Transient Dual Interface Test Method for Thermal Resistance Junction-to-Case of Semiconductor Devices,規(guī)范半導(dǎo)體器件結(jié)到殼熱阻的瞬態(tài)測(cè)試方法。
ASTM E1225-2013 JianCe Test Method for Steady-State Thermal Resistance and Impedance of Built-Up Roofing Systems by Means of a Heat Flow Meter,可用于散熱器多層結(jié)構(gòu)的穩(wěn)態(tài)熱阻測(cè)量。
IEC 60747-9:2017 Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) - Section 3: Test methods,包含IGBT模塊散熱相關(guān)參數(shù)的測(cè)試要求。